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Semiconductor Heat Dissipation


Semiconductor Heat Dissipation Technology is a heat dissipation method that uses the rapid cooling capacity of semiconductor refrigeration sheets to exchange energy through forced cooling.


Working principle: Utilizing the Peltier effect of semiconductor materials, when direct current passes through the galvanic couple formed by N-type semiconductor and P-type semiconductor material in series, heat transfer will occur between the two ends of the galvanic couple, and the heat will be transferred from one end to the other. One end, thus creating a temperature difference, forming a cold end and a hot end. The heat at both ends undergoes reverse heat transfer through the air and the semiconductor material itself. When the hot and cold ends reach a certain temperature difference and the two kinds of heat transfer are equal, a balance point will be reached, and the forward and reverse heat transfer will cancel each other out. At this time, the temperature at the hot and cold ends will not continue to change. Use the refrigeration capacity of the cold end to exchange energy with the object that needs to dissipate heat, so as to achieve the purpose of heat dissipation.


In order to improve the cooling capacity of the cold end of the semiconductor refrigeration chip, different methods can be used to dissipate heat at the hot end. According to the different heat dissipation methods of the hot end, semiconductor radiators are usually divided into air-cooled heat dissipation and water-cooled heat dissipation. Generally speaking, the air-cooled heat dissipation system is small in size and is suitable for heat sources within 100W; the water-cooled heat dissipation system is large in size and high in power and is suitable for heat sources above 100W.


Semiconductor Water Cooling System



Air-cooled cooling system


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